Die Attach Machine Market Report

Die Attach Machine Market Report, Application (Memory, RF & MEMS, LED, CMOS Image Sensor, Logic Semiconductor, Optoelectronics / Photonics and Others), Technique (Epoxy, Soft Solder, Sintering, Eutectic and Others), Type and Geography – Global Market Share, Trend Analysis & Forecast , 2019 - 2028

Report Code : 11391 | Publish Date : March 2022 | Industry : Machinery_Equipment | Geography : Global


The exclusive COVID-19 impact analysis report by Axiom MRC provides a 360 degree analysis of micro and macro-economic factors on the global Die attach machine market. In addition, complete analysis of changes on the global Die attach machine market expenditure, economic and international policies on supply and demand side. The report also studies the impact of pandemic on global economies, international trade, business investments, GDP and marketing strategies of key players present in the market. Moreover, the covid-19 pandemic led to the closure of manufacturing plants and production facilities of semiconductors across the globe. There was also shortage of raw material and skilled labor force that are required in the manufacturing plants of these semiconductors. Pre-covid19 most of the manufacturing facilities were located in APAC region majorly in China but as the Covid-19 emerged in Wuhan China and the country went under a strict lockdown it disrupted the supply chain as China is the manufacturing hub for the world which badly affected the market for die attach machine. 



The global Die Attach Machine market is driven by Growth in semiconductor equipment industries across the globe, as the use of smartphones powered by artificial intelligence (AI) to the adoption of the Internet of Things (IoT), 5G, and the automotive sector is growing rapidly. As the world is gradually moving towards digitalization, there has been a great demand for the semiconductors in the market in various sectors, thus there has been a great demand for the die-attach machines that can be used in semiconductor packaging. Thus, it is expected that as the demand for semiconductor is growing rapidly with increased globalization and growing adoption of smartphone, there has been an increase demand for the die attach machines.   


The market is expected to have new opportunity with increasing demand of smart homes which creates a great opportunity for the die attach machine market to grow further. According to the International Data Corporation's (IDC) Worldwide Quarterly Smart Home Device Tracker, worldwide shipments of smart home devices hit 801.5 million units in 2020, a 4.5 percent increase over 2019, thus as the domestic income is increasing in the developing countries and living standard is increasing, the demand for semiconductors and sensors are increasing, and creating utility of die-attach machines which is providing an opportunity for the die-attach market to grow at a rapid pace.   


The market for die-attach machine market is growing at a rapid pace, but still the key reason which hampers the growth of this market is fluctuation in requirements for various applications in the market owing to the dynamic edge of business, The back-end industry's technology changes may require more capability in a smaller space. Also, future gadgets will combine traditional bonding techniques with the flip chip process to contain chips bonded using traditional processes, also there are certain more technical developments which are taking place, but will only succeed and thrive in high-volume production if economic considerations are taken into account which makes it difficult to meet the satisfy future packaging requirement and may hamper the growth of the market.


The Covid-19 pandemic hampered the growth of market to major extent which has created a major challenges for the market growth. Also, during COVID pandemic, the supply chain got majorly disrupted which adversely affected the semiconductor industry, and created a great challenge for the market for the die-attach market to grow further. However, recently, as the lockdown has been lifted up in almost every part of the globe, it is expected that the market would grow further in coming years. 


The report provides in-depth analysis of global Die Attach Machine market, market size, and compound annual growth rate (CAGR) for the forecast period of 2022-2028, considering 2021 as the base year. The demand for die-attach machinery is increasing as there has been growth in demand for consumer electronics and this market is expected to witness the growth at a specific CAGR from 2022-2028.



The global Die Attach Machine market comprises of different market segment like application, technique, type and geography.


By application, the Die Attach Machine market includes key segment of

  • Memory
  • RF & MEMS
  • LED
  • CMOS Image Sensor 
  • Logic semiconductor
  • Optoelectronics / Photonics
  • Others 

LED application of Die Attach Machine market is expected to dominate the market over the forecast period. The key drivers propelling growth of LED application is the Die attach material characterizes an important role in the performance and consistency of mid, high, and super-high-power LEDs. With a growing LED penetration rate, the demand for die-attach equipment is growing. The selection of suitable die-attach material for a particular chip structure and application depends on numerous considerations, which include packaging process, performance, reliability, and cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and the sintered materials have all been used for LED die attach. Apart from that, logic semiconductor segment is also growing at a rapid pace which has great utility of die-attach machines, helping the market to grow further.


The Die Attach Machine on the basis of technique is consisting of

  • Epoxy
  • Soft solder
  • Sintering
  • Eutectic
  • Others

Epoxy is anticipated to lead the market gaining majority of the market share in 2021 and is expected to maintain its dominance over the estimated time period. The key reason which is driving the demand for the various advantages associated with technique such as, this is extremely effective for assemblies that are exposed to a batch cure in an oven later in the manufacturing process. Another benefit of using epoxies is that, even after a component has been bonded with epoxy, the part can be reworked as long as the assembly has not gone through a cure cycle.


The Die Attach Machine market on the basis of types includes  

  • Flip Chip Bonder
  • Die Bonder

Die Bonder is expected to find increasing demand in the market over the forecast period. Die segment needs to fulfil some requirements like, it should make the intimate contact between the chip and the substrate materials without any voids and must adhere properly to both, it should withstand extreme temperatures without any type of degradation, it should have higher thermal conductivity for the removal of heat generated in the chips, it must be great electrical conductor or good insulator depending on its applications. Thus, this type of die attach machine is versatile for many of the application and helping the market to grow further.    


The global Die Attach Machine market is studied for the following region 

  • North America
  • Europe
  • Asia-Pacific
  • Rest of the world (RoW)

For die attach machine market, North America is considered to be the major market owing to rapid industrialization in the region. Also, the region is consisting of country like US which is one of the largest consumer and producer of the consumer electronics which provides a great platform for the die attach market to grow further. Also, owing to the presence of major key players with state-of-the-art infrastructures as well as the huge production of semiconductors in this region is likely to help the market to grow further.  


The competitive landscape analysis of Die Attach Machines market is majorly focused on expanding the global growth of die attach machines with new product innovation, business expansion, increasing presence of range of manufacturer operating in die attach machines has led the growing demand for the market.  Besides, the market offers range of products in different application to fulfil the required demand of consumer which is further contributing healthy growth in the market.  

The key players studied in market are 

  • ANZA Technology Inc. (United States), 
  • ASM Pacific Technology Limited (Singapore),
  • BE Semiconductor Technology N.V. (Netherlands),
  • Dr. Tresky AG (Switzerland),
  • Fasford Technology Co. Ltd (Japan),
  • Inseto UK Limited (United Kingdom),
  • Kulicke & Soffa Industries, Inc. (Singapore),
  • Palomar Technology (United States),
  • MicroAssembly Technologies (Israel),
  • Shinkawa Ltd. (Japan)


January 2021: ASM Pacific Technology and EV Group announced that they signed a joint development agreement for the co-development of die-to-wafer hybrid bonding solutions for 3D-IC/heterogenous integration applications. Die-to-wafer hybrid bonding is a pivotal process to enable the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology. 

April 2019: Palomar Technologies expanded its Innovation Center in Singapore to further meet the growing demands of photonics companies designing and launching new high-performance packages that enable the Internet-of-Things (IoT) and 5G wireless networks. This expansion also provided the opportunity for Palomar to add their latest die bonder designed for the demanding assembly needs of advanced photonics packages – the 6532HP Die Bonder which exceeds industry standards for placement accuracy and production speed.


Market Sizing for Year:
Base Year:
Forecast Period:
Value:USD million
Market Segment studied:




Market Players and its Competitors:

ANZA Technology Inc. (United States),

ASM Pacific Technology Limited (Singapore),

BE Semiconductor Technology N.V. (Netherlands),

Dr. Tresky AG (Switzerland),

Fasford Technology Co. Ltd (Japan),

Inseto UK Limited (United Kingdom),

Kulicke & Soffa Industries, Inc. (Singapore),

Palomar Technology (United States),

MicroAssembly Technologies (Israel),

Shinkawa Ltd. (Japan)