MARKET OVERVIEW- NORTH AMERICA DIE ATTACH MACHINE MARKET
Die Attach or Die Bonding is the process of attaching a semiconductor die to a package, a substrate such as a PCB board, or another die. The die attaches equipment, including multi-chip bonders for advanced packaging through market techniques such as epoxy, soft solder bonders, etc., to various applications such as memory, RF and MEMS, LED, etc. The rise in demand for electronics products growth in demand for hybrid circuits from medical, military, photonics, and wireless electronics applications, and the growth of the semiconductor packaging industry drive market growth. Additionally, market participants will have profitable growth prospects during the projected period due to the increased use of led circuits.
MARKET DRIVERS
The consumers rising desire for electronics devices increases the chip market, which is expected to indirectly increase demand for die attach machines over the forecasted period. The demand for hybrid circuits from medical, military, photonics, and wireless electronics applications. An increase in demand for hybrid circuits in medical equipment due to an increase in patients is propelling the demand for semiconductor chips. For instance, the United Nations estimates that the geriatric population in the region aged 60 years and older could reach around 606.55 million by 2024. The escalating demand for semiconductor packaging and dies bonding materials is high. The United States Army is working on a brand-new technique for integrating Silicon Carbide-powered semiconductors into modern equipment and weapons. Further, manufacturers in North America are becoming increasingly interested in jet wave machines. Jet wave machines can be utilized for sintering and soldering pastes, and they have the speed and accuracy needed to fuse components above the circuit.
MARKET OPORTUNITIES
During the forecast period, the market’s players will have lucrative growth opportunities dur to the increase in the use of LED circuits. Also, the government policies to promote industries such as automotive and electronics drive the demand for the die attach machine market. Moreover, the increase in demand for LED chips will expected to create a lucrative opportunity for the the die attach machine market growth.
MARKET RESTRAINTS
A significant restraint on the market is the fluctuation in raw material prices. Die attach machines are primarily made from raw materials such as metal, silicon, and plastic. For the past few years, the price of these raw materials has been fluctuating, owing to a range of economic and speculative aspects.
MARKET GROWTH CHALLENGES
A key challenge that may affect the growth of the market is that government-led stringent laws, tariffs, and regulations against deforestation, metals, and other materials used in die attach machines have substantially declined revenues and manufacturers' profits. For example, in 2018, the US government increased tariffs on the import of metals (effective from February 2020) by 25% on steel and 10% on aluminum, which further escalated the costs of these metals in the US. Such factors can challenge the development of the market.
CUMULATIVE GROWTH ANALYSIS
The report provides an in-depth analysis of North America Die Attach Machine market, market size, and compound annual growth rate (CAGR) for the forecast period of 2023-2029, considering 2022 as the base year. The booming semiconductor packaging industry has led to increasing demand for market and is expected to witness the growth at a specific CAGR from 2023-2029.
NORTH AMERICA DIE ATTACH MACHINE MARKET SEGMENTAL OVERVIEW
The North America die attach machine market comprises of different market segments like type, technique, application and country.
NORTH AMERICA DIE ATTACH MACHINE MARKET BY TYPE
By type, the die attach machine market includes the key segments of
- Flip Chip Bonder
- Die Bonder
The die bonder segment is expected to witness the high demand over the forecast period. The die bonder machine performs the process of attaching a die to a substrate or packaging using epoxy or solder. The procedure begins with selecting a die from a wafer or waffle pack and laying it on the substrate in an exact position. Also, the emerging demand for cutting-edge technologies like UHD TVs, hybrid laptops, and smartphones with integrated circuits. Numerous devices, including optoelectronics, MEMS, and MOEMS, are used in these goods, and die bonding equipment is necessary to assemble these components. Thus, the increasing electronic device manufacturing is expected to expand the die bonder market.
NORTH AMERICA DIE ATTACH MACHINE MARKET BY TECHNIQUE
By technique, the die attach machine market includes the key segments of
- Epoxy
- Soft solder
- Sintering
- Eutectic
- Others
The epoxy segment is expected to witness high demand over the forecast period. This technique is increasingly accepted for the most demanding microelectronic semiconductor packaging. They have excellent resistance to thermal cycling, mechanical shock, and vibrations, making them trending in the die attach market. The epoxy technique is a dependable, consistent, and flexible method of component attachment given the rapid expansion of the automatic packaging process. Epoxy can be used to fabricate digital and analog circuits due to its dimensional stability, high level of control, handling, and integration. These factors are expected to boost the segment growth.
NORTH AMERICA DIE ATTACH MACHINE MARKET BY APPLICATION
By application, the die attach machine market includes the key segments of
- Memory
- RF & MEMS
- LED
- CMOS Image Sensor
- Logic semiconductor
- Optoelectronics / Photonics
- Others
The LED segment is expected to witness the high demand over the forecast period. Mid, high, and super-high-power LED performance and dependability are greatly influenced by the die attach material. As the rate of LED penetration rises, so does the demand for die-attach equipment. The packaging process (throughput and yield), performance (thermal dissipation output and light output), reliability (lumen maintenance), and cost all play a role in choosing the best die-attach material for a given chip structure and application. For attaching LED dies, various materials including eutectic gold-tin, silver-filled epoxies, solder, silicones, and sintered materials have been used. Furthermore, the growth of the die attach machine market depends on the growth of the LED chip industry. The rise in LED chip usage in fishing lighting, healthcare, marine, horticulture, and others offers lucrative growth opportunities for the manufacturer of die attach machines during the forecast period.
NORTH AMERICA DIE ATTACH MACHINE MARKET BY COUNTRY
The North America die attach machine market is studied for the following countries
- United States
- Canada
- Mexico
The United States is expected to dominate the market over the forecast period. The need for die bonder equipment is anticipated to be driven by the high concentration of integrated circuit (IC) manufacturers in the region. Artificial intelligence, quantum computing, and enhanced wireless network are opening up new frontiers in semiconductor demand, which American companies are well-positioned to tale advantage of. The US-based company, Intel corporation, is the leading manufacturer of hybrid chips, motherboards, and microprocessor for electronic devices such as laptops and computers. Further, the growth driven by increased investment in R&D activities. In the coming years, the US government is funding establishing 7-10 new semiconductor factories, which is expected to fuel the die attach machine market manufacturing.
COVID-19 IMPACT ANALYSIS ON NORTH AMERICA DIE ATTACH MACHINE MARKET
Axiom MRC provides a 360-degree analysis of micro and macro-economic factors on the North America die attach machine market. In addition, a complete analysis of changes on the North America die attach machine market expenditure, economic and international policies on supply and demand side is provided in this exclusive report. The report also studies the impact of pandemic on North America economies, international trade, business investments, and GDP and marketing strategies of key players present in the market.
Increasing cases of COVID-19 across the globe is resulting in economic slowdown. The impact of COVID-19 is being seen in every sector of the economy, including the North America semiconductor industry. However, the impact of COVID-19 does not affected the demand for equipment. For instance, during the pandemic, Palomar technologies announced that they got a request for manufacturing critical semiconductor components to address COVID-19. They saw an acceleration of orders of their 3880 Die bonder equipment to assist in wireless communications and networking bandwidth, remote medicine, IoT in robotics, and video conferencing. Hence, the demand for equipment has remained relatively high during the pandemic.
COMPETITIVE LANDSCAPE ANALYSIS
The competitive landscape analysis of the North America Die Attach Machines market is primarily focused on expanding the growth of die attach machines with new product innovation, business expansion, the increasing presence of a range of manufacturer operating in die attach machines has led to growing demand for the market. Besides, the market offers a range of products in different application to fulfil the required demand of consumer, which further contributes to healthy growth in the market.
The key players studied in market are
- ANZA Technology Inc.
- ASM Pacific Technology Limited
- BE Semiconductor Technology N.V.
- Dr. Tresky AG
- Fasford Technology Co. Ltd
- Inseto UK Limited
- Kulicke & Soffa Industries, Inc.
- Palomar Technology
- MicroAssembly Technologies
- Shinkawa Ltd.
RECENT DEVELOPMENT:
October 2022: - Hermetic Solutions Group (HSG) acquired the Intellectual property of DiaCool, from RHP Technologies. This expands HSG's product lineup and offers customers significantly more options for many years. HSG's DiaCool diamond composite material for heat sinks, die tabs, and heat spreaders provide customers with significant advantages over conventional laminate or MMC materials.
